November 30, 2009 04:30 ET

STATS ChipPAC Ramps eWLB Technology to High Volume Production

Robust Manufacturing Process in Place to Support First Generation eWLB

SINGAPORE -- 11/30/2009, UNITED STATES--(Marketwire - November 30, 2009) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced it has ramped first generation embedded Wafer-Level Ball Grid Array (eWLB) technology to high volume production.

The eWLB technology provides solutions for semiconductor devices requiring a higher integration level and a greater number of external contacts. Using a combination of traditional 'front-end' and 'back-end' semiconductor manufacturing techniques, eWLB technology greatly reduces manufacturing costs while providing a smaller package footprint with higher Input/Output (I/O) along with increased thermal and electrical performance.

STATS ChipPAC has established a robust, automated eWLB manufacturing process that includes wafer reconstitution, wafer level molding, redistribution using thin film technology, solder ball mount, package singulation and testing. Incoming wafers in both 8" and 12" diameters can be supported, and no bumping is required as the package is essentially built on top of a reconstituted wafer.

"Backed by a strong infrastructure and cost effective manufacturing process, we are able to deliver a high performance solution at a lower cost point with volume and maturity, leveraging the potential of batch panel processing of high density wafer fabrication redistribution technology," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer of STATS ChipPAC. "We successfully demonstrated the reliability of first generation eWLB technology, ramped to volume production and are positioned to double our production unit volume by the end of 2009."

Typical applications for eWLB are baseband and RF products for mobile and consumer products. The next generation of eWLB packages enabling reduced cost, multiple routing layers, multiple die, and expansion to larger package size and ball count is now being developed with STATS ChipPAC's development partners for product offerings starting in 2010.

Forward-Looking Statements

Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, deterioration in general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; customer credit risks; possible future application of push-down accounting; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; our ability to generate cash; potential impairment charges; availability of financing; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; our ability to meet specific conditions imposed for the continued listing or delisting of our ordinary shares on the Singapore Exchange Securities Trading Limited (SGX-ST); classification of the Company as a passive foreign investment company; our ability to develop and protect our intellectual property; rescheduling or canceling of customer orders; changes in our product mix; our capacity utilization; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; shortages in supply of key components; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labor union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; and other risks described from time to time in the Company's filings with the U.S. Securities and Exchange Commission, including its annual report on Form 20-F dated March 9, 2009. You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at Information contained in this website does not constitute a part of this release.

Contact Information

  • Investor Relations Contact:
    Tham Kah Locke
    Vice President of Corporate Finance
    Tel: (65) 6824 7788
    Fax: (65) 6720 7826
    email: Email Contact

    Media Contact:
    Lisa Lavin
    Deputy Director of Corporate Communications
    Tel: (208) 867-9859
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