SINGAPORE--5/4/2011, UNITED STATES--(Marketwire - May 3, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider today announced that it has shipped over
STATS ChipPAC Ships Over 300 Million Copper Wirebond Units and Expands Fine Pitch Solutions
| Source: STATS ChipPAC