SOURCE: STATS ChipPAC

STATS ChipPAC

May 03, 2011 16:00 ET

STATS ChipPAC Ships Over 300 Million Copper Wirebond Units and Expands Fine Pitch Solutions

SINGAPORE--5/4/2011, UNITED STATES--(Marketwire - May 3, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider today announced that it has shipped over 300 million semiconductor packages with copper wirebond interconnect and is rapidly expanding its technology offering to support a broader range of applications and finer silicon nodes.

The transition from gold to copper wire interconnect in semiconductor packages offers a significant savings in material costs while meeting electrical and thermal performance characteristics with quality and reliability standards that are comparable to gold wire. STATS ChipPAC has copper wirebond capabilities in all five of its manufacturing facilities in Asia, each with class 1000 cleanroom environments to ensure best-in-class assembly yields and reliability. Production volume has been rapidly increasing in both leadframe and laminate packages.

"We are seeing a tremendous level of interest from our customers in copper wire. There are clear and measurable benefits in the transition to copper wire interconnect, particularly in terms of cost. We are in high volume manufacturing for a large number of devices across multiple factories and have built significant momentum on the engineering front to introduce copper wire into a wider range of applications in the communication, computing and consumer markets," said Hal Lasky, Executive Vice President and Chief Sales Officer, STATS ChipPAC.

STATS ChipPAC is actively investing in equipment and resources to support copper wire technology in wafer nodes down to 45/40 nm with low-k and extra low-k (ELK) dielectric materials. Development work is focused on finer bond pad pitches, thinner wire diameters, stacked die packaging and die-to-die bonding, each of which represents a greater set of challenges in the application of copper wire.

"We are successfully addressing many of the technical challenges that are associated with using copper wire interconnect in more complex package structures. We have been aggressively developing copper wire capabilities in all our factories and rapidly expanding into a broader range of fine pitch devices and advanced silicon nodes. Our dedicated resources, especially our strong global copper wire engineering organization, ensure a consistent and successful transition to copper wirebond for our customers," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, shortages in supply of key components and disruption in supply chain; general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Contact Information

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