February 21, 2007 08:30 ET

STATS ChipPAC to Present at the Morgan Stanley Technology Conference

UNITED STATES -- (MARKET WIRE) -- February 21, 2007 -- SINGAPORE -- 2/21/2007 -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ: STTS) and (SGX-ST: STATSChP), a leading independent semiconductor test and advanced packaging service provider, announced that the Company is scheduled to present at the Morgan Stanley Technology Conference on Thursday, March 8, 2007 in San Francisco. Scott Jewler, Executive Vice President and Chief Strategy Officer, will present at the conference. The Company plans to webcast this presentation on its website at

Place:          The Palace Hotel San Francisco
Time:           2:15 p.m. Thursday, March 8, 2007 in San Francisco
                5:15 p.m. Thursday, March 8, 2007 in New York
                6:15 a.m. Friday, March 9, 2007 in Singapore
About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ: STTS) and (SGX-ST: STATSChP) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions. A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated, multi-site, end-to-end packaging and testing solutions that bring products to the market faster. Our customers are some of the largest wafer foundries, integrated device manufacturers (IDMs) and fabless companies in the United States, Europe and Asia. STATS ChipPAC is a leader in mixed signal testing and advanced packaging technology for semiconductors used in diverse end market applications including communications, power, digital consumer and computing. With advanced process technology capabilities and a global manufacturing presence spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC has a reputation for providing dependable, high quality test and packaging solutions. The Company's customer support offices are centered in the United States (California's Silicon Valley, Arizona, Texas, Massachusetts, Colorado and North Carolina). Our offices outside the United States are located in South Korea, Singapore, China, Malaysia, Taiwan, Japan, the Netherlands and United Kingdom. STATS ChipPAC's facilities include those of its subsidiary, Winstek Semiconductor Corporation, in Hsinchu District, Taiwan. These facilities offer new product introduction support, pre-production wafer sort, final test, packaging and other high volume preparatory services. Together with our research and development centers in South Korea, Singapore, Malaysia, China, Taiwan and the United States as well as test facilities in the United States, this forms a global network providing dedicated test engineering development and product engineering support for customers from design to volume production. STATS ChipPAC is listed on both the Nasdaq Stock Market and the Singapore Exchange Securities Trading Limited. In addition, STATS ChipPAC is also included in the Morgan Stanley Capital International (MSCI) Index and the Straits Times Industrial Index. Further information is available at Information contained in this website does not constitute a part of this release.

Contact Information

  • Singapore Contact:
    Bryan Ong
    Investor Relations
    Tel: (65) 6824 7477
    Fax: (65) 6720 7826
    email: Email Contact

    US Contacts:
    Drew Davies
    Director, Investor Relations
    Tel: (408) 586 0608
    Fax: (408) 586 0652
    email: Email Contact

    Lisa Lavin
    Marcom Manager
    Tel: (208) 939 3104
    Fax: (208) 939 4817
    email: Email Contact

    The Ruth Group
    David Pasquale
    Executive Vice President
    Tel: (646) 536 7006
    email: Email Contact