UNITED STATES -- (MARKET WIRE) -- February 21, 2007 -- SINGAPORE -- 2/21/2007 -- STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (
NASDAQ:
STTS) and (SGX-ST: STATSChP), a
leading independent semiconductor test and advanced packaging service
provider, announced that the Company is scheduled to present at the Morgan
Stanley Technology Conference on Thursday, March 8, 2007 in San Francisco.
Scott Jewler, Executive Vice President and Chief Strategy Officer, will
present at the conference. The Company plans to webcast this presentation
on its website at
www.statschippac.com
Place: The Palace Hotel San Francisco
Time: 2:15 p.m. Thursday, March 8, 2007 in San Francisco
5:15 p.m. Thursday, March 8, 2007 in New York
6:15 a.m. Friday, March 9, 2007 in Singapore
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (
NASDAQ:
STTS) and
(SGX-ST: STATSChP) is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions. A trusted partner and
supplier to leading semiconductor companies worldwide, STATS ChipPAC
provides fully integrated, multi-site, end-to-end packaging and testing
solutions that bring products to the market faster. Our customers are some
of the largest wafer foundries, integrated device manufacturers (IDMs) and
fabless companies in the United States, Europe and Asia. STATS ChipPAC is a
leader in mixed signal testing and advanced packaging technology for
semiconductors used in diverse end market applications including
communications, power, digital consumer and computing. With advanced
process technology capabilities and a global manufacturing presence
spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC
has a reputation for providing dependable, high quality test and packaging
solutions. The Company's customer support offices are centered in the
United States (California's Silicon Valley, Arizona, Texas, Massachusetts,
Colorado and North Carolina). Our offices outside the United States are
located in South Korea, Singapore, China, Malaysia, Taiwan, Japan, the
Netherlands and United Kingdom. STATS ChipPAC's facilities include those
of its subsidiary, Winstek Semiconductor Corporation, in Hsinchu District,
Taiwan. These facilities offer new product introduction support,
pre-production wafer sort, final test, packaging and other high volume
preparatory services. Together with our research and development centers in
South Korea, Singapore, Malaysia, China, Taiwan and the United States as
well as test facilities in the United States, this forms a global network
providing dedicated test engineering development and product engineering
support for customers from design to volume production. STATS ChipPAC is
listed on both the Nasdaq Stock Market and the Singapore Exchange
Securities Trading Limited. In addition, STATS ChipPAC is also included in
the Morgan Stanley Capital International (MSCI) Index and the Straits Times
Industrial Index. Further information is available at
www.statschippac.com.
Information contained in this website does not constitute a part of this
release.
Contact Information: Singapore Contact:
Bryan Ong
Investor Relations
Tel: (65) 6824 7477
Fax: (65) 6720 7826
email: Email Contact
US Contacts:
Drew Davies
Director, Investor Relations
Tel: (408) 586 0608
Fax: (408) 586 0652
email: Email Contact
Lisa Lavin
Marcom Manager
Tel: (208) 939 3104
Fax: (208) 939 4817
email: Email Contact
The Ruth Group
David Pasquale
Executive Vice President
Tel: (646) 536 7006
email: Email Contact