SOURCE: Tech Soft 3D

Tech Soft 3D

March 28, 2011 09:00 ET

Tech Soft 3D Announces Second Annual Customer Meeting at COFES 2011

Event to Outline Pivotal New Technologies, Product Roadmaps to Industry Executives

BERKELEY, CA--(Marketwire - March 28, 2011) - Tech Soft 3D, leading provider of 3D component technology to the engineering software industry, today announced its second annual Customer Meeting will again be held at COFES, The Congress on the Future of Engineering Software, on April 14 in Scottsdale, Arizona. 

"There's no question that COFES is the right venue to discuss our high-level planning," says Tech Soft 3D CEO Ron Fritz. "So many COFES attendees rely on one or more of our component technologies and are deeply invested in our strategy for 2011 and beyond."

The meeting will feature roadmaps, highlights and demonstrations of HOOPS 3D Framework™ and HOOPS 3D Exchange™, as well as a discussion of the industry variables that guide these time-tested and innovative components. Tech Soft will also announce a much-anticipated 3D PDF-based technology. For more itinerary details, visit the Annual Tech Soft 3D Customer Meeting web page. 

"With exciting new products and record revenue growth, 2010 was a great year for Tech Soft 3D," says Fritz. "2011 promises to be even better."

Those interested in attending COFES can contact Ron Fritz at ron@techsoft3d.com to arrange an invitation. The event is slotted from 1-3 p.m. on Thursday, April 14 at the Scottsdale Plaza Resort, Las Palmas Room "A."

About COFES

COFES is a unique conference that focuses on intense sessions of discussion, argument and debate on issues that will affect businesses that invest in and depend upon engineering technologies. The 12th annual COFES runs Thursday, April 14 through Sunday, April 17. See the COFES Web site for additional information on the agenda, keynote speakers and registration.

About Tech Soft 3D

Tech Soft 3D provides premier component technologies and related services that enable software developers to rapidly create world-class technical software. The company develops HOOPS 3D Framework and HOOPS 3D Exchange and resells premium components such as Autodesk's RealDWG® Toolkit and AutoCAD® OEM platform and the Parasolid® Modeling Kernel from Siemens PLM Software. Its software is used in nearly 450 applications worldwide. The company maintains corporate headquarters in Berkeley, California and can be reached through http://www.techsoft3d.com.

Contact Information

  • Tech Soft 3D Media Contact

    Jackie Aaro
    Phone: 541-385-6158
    Email Contact