SOURCE: Tekelec


September 01, 2011 17:46 ET

Tekelec to Discuss the Future of LTE Service Delivery and Interoperability at LTE Asia 2011

Principal Architect Matt McCann to Discuss Scaling and Securing the Diameter Core Network

MORRISVILLE, NC--(Marketwire - Sep 1, 2011) - Tekelec (NASDAQ: TKLC), the mobile broadband solutions company, is a bronze sponsor and speaker at the 6th annual LTE Asia conference, held in Suntec City, Singapore from September 6 - 7, 2011 at the International Convention & Exhibition Centre.

Matt McCann, principal architect, will discuss how to cost effectively scale and secure Diameter traffic in LTE networks. Mr. McCann will speak on key Diameter interfaces, and use cases for policy management and charging, roaming between LTE networks and topology hiding. His session will be held on September 6 at 2:40 p.m.

At 4:20 p.m., Mr. McCann will join the "Enabling Advanced Services Using the Diameter Signaling Protocol" panel, which includes Dimitris Mavrakis, senior analyst at Informa Telecoms & Media. The panel will cover:

  • The importance of Diameter to all-IP networks
  • How to provide cost-effective, intelligent network solutions for data-dominated networks
  • Scaling the network as subscribers and traffic grow

The next day at 6:30 p.m., Dan Bantukul, principal architect, will be a panelist for the "What is the Impact of introducing LTE into mature HSPA, GSM and EDGE Networks?" topic. The panel includes Japanese operator KDDI and Indonesian operator PT Telkomsel. Discussion topics include:

  • Performance and customer experience risks from deploying multiple network technologies
  • Opportunities to support technology based coverage zones
  • Effective strategy for introducing new services
  • Assessment to adding LTE deployment to legacy networks
  • Switching legacy networks off during LTE migration

Full LTE Asia 2011 program information can be found at

Mr. McCann brings more than 20 years of telecommunications experience, including 13 years at Tekelec in product management and marketing. Prior to Tekelec, McCann worked for AT&T Bell Laboratories in various systems engineering and system test roles for both switching and intelligent network systems.

Mr. Bantukul has more than 20 years of industry experience in hardware engineering, embedded system programming, product management and product marketing. He has extensive knowledge of Diameter, SIP, and SS7 and has been awarded numerous patents.

Supporting Resources
The Rise of Diameter Signaling white paper
Diameter Signaling Router application handbook
Frost & Sullivan's New Product Innovation Award, Diameter Routing
The Path to LTE white paper

About Tekelec
Tekelec connects people and devices to the mobile Internet. Our portfolio's unique layer of network intelligence allows service providers to both manage and monetize the exponential growth in mobile web, video and applications traffic. Tekelec has more than 25 offices around the world serving customers in more than 100 countries. For more information visit