SANTA CLARA, CA--(Marketwire - Oct 24, 2012) - Tensilica®, Inc. today announced that it has moved to larger offices at 3393 Octavius Drive, Santa Clara, Calif., USA to accommodate its expanding number of employees and projected continued growth. Tensilica now occupies over 36,000 square feet at its new location and employs more than 190 people, of which over half will be located in this new headquarters building. Tensilica's growth has been driven by market demand for key products in audio and baseband DSP (digital signal processing).
The new location includes a much larger training facility, additional conference rooms, a state-of-the-art demo facility, and additional space for employees.
In addition to this growth in the USA, within the past year Tensilica has moved to larger facilities for its R&D and support teams both in India and China.
"Tensilica's customer base has grown extensively as we have become the recognized leader in DPUs (dataplane processor units) with both our standard subsystem IP solutions and our semi-custom products. Our ability to optimize IP cores using automatic tools has enabled us to get 30 percent or more performance/power/area over competitors yielding strong adoption to date in audio, voice and baseband signal processing," said Jack Guedj, Tensilica president and CEO. "This has fueled our growth, requiring us to hire additional talent to join our stellar team of employees. This new office space will enable us to work together most effectively and efficiently in servicing and training our growing customer base."
Recent announcements from Tensilica have highlighted the company's growth and leadership including Tensilica Licensees Ship Two Billion IP Cores; License Revenue Now Larger than Any Other DSP Licensing Company and Tensilica Reaches Audio/Voice DSP Milestone: Most Widely Licensed Audio Architecture for SOC Design.
Tensilica, Inc. is the leader in dataplane processor IP cores, with almost 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
Tensilica is a registered trademark belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.