August 04, 2005 16:28 ET

TIA and IEC Join Forces to Deliver World-Class Conference Programming at GLOBALCOMM 2006; IEC Programs to Address Critical Business and Technical Issues Facing Global Service Providers

ARLINGTON, Va.--(CCNMatthews - Aug 4, 2005) -

The Telecommunications Industry Association (TIA) announced today it will work with the International Engineering Consortium (IEC) to serve as content provider for GLOBALCOMM™ 2006 educational programs offered to the global service provider community. The next-generation communications marketplace and summit takes place June 4 - 8, 2006.

"TIA, in its role as the manager of SUPERCOMM®, enjoyed a long relationship with the IEC and, with SUPERCOMM®'s conclusion, we are very pleased to leverage their considerable expertise and offer the industry access to their world-class conference programs at the debut of GLOBALCOMM™ 2006," said TIA President Matthew J. Flanigan. GLOBALCOMM™ replaces SUPERCOMM® as TIA's principal trade show. The last SUPERCOMM® took place June 5 - 8, 2005, and drew nearly 28,000 attendees from 100 countries.

Specifically, the IEC will create customized carrier content and produce two paid conference programs at GLOBALCOMM™: IEC Communications Forums and the IEC Executive Forum. For a decade, both conferences were among SUPERCOMM®'s most popular and well-attended paid programs featuring many of the industry's most influential leaders, including Duane Ackerman, Chief Executive Officer, BellSouth; Paul Reynolds, Chief Executive Officer, BT Wholesale; Lawrence Babbio, Vice Chairman, Verizon; and Richard Green, Chief Executive Officer, CableLabs.

IEC Executive Director Robert M. Janowiak said, "The IEC will present a very insightful and comprehensive educational program covering the changing communications environment. Focusing on IP infrastructure, the IEC Communications Forums will present many applications including wireless and wireline for service providers and enterprise users."

Along with its next-generation marketplace featuring more than 450 exhibitors, GLOBALCOMM™ 2006 will offer a variety of quality educational opportunities - both free and paid - for delegates. Programming and conferences will address the entire ICT chain on a world-wide level including case studies, interactive demonstrations of new technologies, commercial deployments and industry analysis focused around IP infrastructure, applications and devices, security and content across the wireless, wireline and enterprise segments.

About TIA

TIA is the leading trade association for the information and communications technology (ICT) industry. As owner and producer of GLOBALCOMM™, TIA serves ICT suppliers to global markets through its leadership in standards development, domestic and international policy advocacy, and facilitating member business opportunities. TIA represents the communications sector of the Electronic Industries Alliance (EIA). Visit us at


GLOBALCOMM™ is a trademark of the Telecommunications Industry Association (TIA). The Next-Generation Communications Marketplace and Summit will take place June 4 - 8, 2006, at McCormick Place in Chicago, Illinois, USA. Visit

About IEC

IEC is a non-profit, university-affiliated organization dedicated to catalyzing positive change in the information, semiconductor and electronic-design industries. The IEC, which is headquartered in Chicago, Illinois, USA, publishes research, develops educational forums and provides Web-based learning programs. More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. The IEC also manages the activities of the Enterprise Communications Consortium.

SUPERCOMM® is a registered trademark of the Telecommunications Industry Association (TIA) and the United States Telecom Association (USTA).

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