SOURCE: Credence Systems Corporation

March 25, 2008 17:29 ET

TS2 Micro Selects Diamond 10 Test Platform From Credence

High Precision Mixed-Signal Technology and Multi-Site Capability Enable Cost-Effective and Comprehensive Testing From Design Through Debug and Production

MILPITAS, CA--(Marketwire - March 25, 2008) - Credence Systems Corporation (NASDAQ: CMOS), a provider of test solutions for the worldwide consumer semiconductor industry, announced today that TS2 Micro Ltd. (U.K.), a supplier of semiconductor die packaging, test and obsolescence services for industrial, commercial, aerospace, space and military markets, has selected the Diamond 10 (D10) system for testing a wide variety of components varying both in complexity and pin count.

The growing fabless base in the U.K. and across Europe provides TS2 Micro with an expanding market opportunity to which it may offer the D10 as a fast and cost effective solution for this emerging test need. Jamie Knight, Managing Director of TS2 Micro, says, "The combination of the D10's size, scalability and overall cost-of-test benefits make it a compelling solution to enable us to expand into the fabless market, as well as providing the quality and accuracy to allow us to continue our strong position in the demanding aerospace, space and military markets."

Amir Aghdaei, Senior Vice President of WW Field Operations at Credence, says, "The selection of the Diamond 10 by TS2 Micro is an important mark for Credence. This is the first D10 to be selected by a U.K. test house, and is yet another indicator of the rapidly accelerating acceptance of the Diamond platform. We are especially pleased that D10 has already enabled TS2 Micro to attract new business opportunities."

The Diamond 10 test system is a high throughput production solution that effectively lowers customers' total cost of ownership, making it suitable for testing cost-sensitive consumer IC devices. Its air-cooled, ultra-compact form factor, small footprint and low power consumption makes the D10 optimal for use in the lab or clean room environments. The ten-slot Diamond 10 architecture can be configured with a range of test instruments. Typical configurations support up to 768 200-Mbps digital channels, and 8 channels of analog waveform generation and capture.

About TS2 Micro Ltd.

TS2 Micro Ltd. offers semiconductor die packaging, test and obsolescence services for industrial, commercial, aerospace, space and military markets. TS2 Micro Ltd. has developed Europe's widest range of packaging capabilities and techniques that allow the company to handle a wide variety of interconnection requirements. TS2 Micro Ltd. supports demand from prototyping to production. With design, manufacture and test housed in the same U.K.-based ISO9001/2001and AS9100 approved facility, it is well placed to support the European marketplace. TS2 Micro Ltd is a member of the ASC Group Europe, which includes Tru Form, Mintech and Die Technology.

About Credence

Credence Systems Corporation is a global provider of automated test equipment (ATE) solutions to the high growth, consumer semiconductor industry. Credence is committed to deliver the highest standards of value -- an optimal combination of technology, turn-around time, reliability, ease of use, service and support -- to every customer, which enables important cost and performance advantages for integrated device manufacturers (IDMs), wafer foundries, outsource assembly and test (OSAT) suppliers and fabless chip companies worldwide. An ISO 9001-certified company with a presence in 20 countries, Credence is headquartered in Milpitas, California. More information is available at

Credence is a registered trademark, and Credence Systems is a trademark of Credence Systems Corporation. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.

Contact Information

  • Media Relations Contact:
    David Pinto
    Communications Director
    Credence Systems Corporation
    Phone: 408-635-4868
    FAX: 408-635-4986
    E-mail: Email Contact