SOURCE: TXP Corporation

September 11, 2007 07:30 ET

TXP Deploys Successful Package-on-Package (PoP) Process

RICHARDSON, TX--(Marketwire - September 11, 2007) - TXP (OTCBB: TXPO), a leading provider of Pre-Manufacturing Services for the electronics and telecommunications industries, today announced that it has successfully deployed a Package-on-Package (PoP) process to support several of its global customers.

PoP is a complex, cutting edge manufacturing process that began in mobile multimedia products such as cell phones and MP3 players. Current PoP stacks consist of a high density bottom package mated to a memory package on top. TXP believes that its process reduces the manufacturing time by placing the processor on the board, then placing the memory on the processor prior to reflow.

TXP has successfully demonstrated this process for several of its high tech customers.

"We believe that PoP applications are exploding because consumers are demanding mobile multimedia products that are smaller, lighter, with more functionality and higher performance, and at lower costs," according to Michael Shores President and CEO of TXP. "We expect our PoP process to successfully reduce the manufacturing time and associated costs and risks for several of our customers."

"AMX has been working with TXP for several years, and we look forward to the successful implementation of its PoP technology in one of our newest products, which will be smaller than the previous generation due in part to this new process," said Harold Hickey, AMX vice president of operations. "TXP's quick-turn capability, as well as its commitment to technology innovation, will continue to help AMX design and manufacture some of the high-quality products that our customers have come to expect from us."

About TXP

TXP Corporation is an Original Design Manufacturer (ODM) for the telecommunications industry. Based in Richardson, Texas, TXP has three primary business units: TXP-Texas Prototypes, TXP-Retrofit Solutions, and TXP-ONT Solutions. TXP-Texas Prototypes provides pre-manufacturing services for the electronics industry that help original equipment manufacturers (OEMs) bring products to market both faster and more cost effectively. TXP-Retrofit Solutions provides custom engineering kits to enable ILECs (Incumbent Local Exchange Carriers) to upgrade their local access service delivery infrastructure at minimum cost and time. TXP's retrofit kits enable a wide range of next-generation telecom platforms to easily fit into the variety of remote cabinets that have been broadly deployed by ILECs over the last 30 years. TXP-ONT Solutions comprises the former Siemens' Optical Network Terminal (ONT) development team hired in late 2006. This group develops and markets via an ODM model the iPhotonics family of ONT products to both OEMs and ILECs to be private-label branded. The ONT technology terminates the passive optical network at the home or business location, and enables integrated voice, video and high-speed internet access. For more information visit:

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