SOURCE: Varian Semiconductor

June 21, 2005 10:00 ET

Varian Semiconductor Announces Shipment of VIISta Ion Implanter Platform to Winbond

Leadership in Single Wafer Technology Key Factor in Tool Selection

GLOUCESTER, MA -- (MARKET WIRE) -- June 21, 2005 -- Varian Semiconductor Equipment Associates, Inc. (NASDAQ: VSEA) announced today that it has shipped a platform of VIISta single wafer ion implanters to Winbond Electronics Corporation in Taiwan to be used in 300mm production. The shipment of platform tools consist of VIISta HC high current, VIISta 810XE medium current and VIISta 3000HP high energy ion implanters. The full suite of VIISta platform tools has now been selected by multiple semiconductor manufacturers in Asia and the United States.

Winbond selected Varian Semiconductor due to its market leadership in single wafer ion implanters and the cost of ownership benefits associated with a complete platform of VIISta products. Victor Wang, 300mm Fab Director of Winbond, said, "Varian Semiconductor's single wafer ion implanters provide us with a flexible manufacturing solution to meet our advanced production requirements. We selected an all-single wafer solution because they are inherently cleaner and offer greater process flexibility. With the single wafer VIISta platform, we are able to reduce the overall number of ion implanters and lower our capital costs, while maintaining high productivity over a broad range of applications."

"We believe the clear message behind this platform order is that advanced devices require the repeatability, cleanliness and high productivity advantages of single wafer ion implantation," said Gary Dickerson, Varian Semiconductor's chief executive officer. "We are looking forward to working together with Winbond to implement the technology, cost and flexibility advantages that can be achieved with the VIISta platform of single wafer ion implanters."

The VIISta products make up the only production-proven single wafer platform of ion implanters in the industry. All of the VIISta products feature the Varian Control System (VCS™), the Varian Positioning System (VPS™) and a common single wafer endstation. This high degree of commonality across the VIISta platform eases integration into factory automation, lowers spare parts and training costs, and simplifies tool operation.

About Varian Semiconductor

Varian Semiconductor Equipment Associates, Inc. is a leading producer of ion implantation equipment used in the manufacture of semiconductors. The company is headquartered in Gloucester, Massachusetts, and operates worldwide. Varian Semiconductor maintains a web site at www.vsea.com. The information contained in the Company's web site is not incorporated by reference into this release, and the web site address is included in this release as an inactive textual reference only.

About Winbond

Winbond Electronics Corporation was founded in Hsinchu Science-Based Industrial Park, Taiwan, in 1987. By positioning itself as a "Mobile Electronics Solution" provider, Winbond owns two business groups -- Logic IC Business Group and Memory IC Business Group. Logic IC Business Group focuses on three specific domains: microcontroller-based ICs, PC & peripherals and network access ICs. As to Memory IC Business Group, the products include Specialty DRAM, Pseudo SRAM and Flash. It has become the largest IDM (Integrated Device Manufacturer) Company in Taiwan semiconductor industry. With more than 4,200 employees worldwide, the Company has subsidiaries located in America, Japan, Hong Kong and China. Further information is available at: http://www.winbond.com.

Note: This release contains forward-looking statements for purposes of the safe harbor provisions under The Private Securities Litigation Reform Act of 1995. For this purpose, the statements concerning the Company's performance, market share and technology leadership, technological capabilities and benefits are forward-looking statements and any statements using the terms "believes," "anticipates," "expects," "plans," or similar expressions are forward-looking statements. There are a number of important risks and factors that could cause actual events to differ materially from those suggested or indicated by such forward-looking statements. These include, among others, volatility in the semiconductor equipment industry; economic conditions in general and as they affect the Company's customers; significant fluctuations in the Company's quarterly operating results; the impact of rapid technological change; the Company's dependence on the development and introduction of new products; the Company's concentration on ion implantation systems and related products; concentration in the Company's customer base and lengthy sales cycles; the highly competitive market in which the Company competes; risks of international sales; foreign currency risks; and general economic conditions; and other factors identified in the Company's Annual Report on Form 10-K, and the most recent Quarterly Reports on Form 10-Q filed with the Securities and Exchange Commission. The Company cannot guarantee any future results, levels of activity, performance or achievement. The Company undertakes no obligation to update any of the forward-looking statements after the date of this press release.

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