SOURCE: Vicor Corporation

Vicor Corporation

March 04, 2013 10:30 ET

Vicor's New Conduction Cooled Westcor MicroPAC Power System Delivers Extreme Power Density and Efficiency in a Ruggedized Platform

Thermally-Optimized, Noise-Free AC-DC Power System Provides up to 1300 W of Continuous Power at up to 92% Efficiency With 25 Win3 Density

ANDOVER, MA--(Marketwire - Mar 4, 2013) -  Vicor Corporation (NASDAQ: VICR) today introduced a new conduction-cooled version of its high-efficiency Westcor™ MicroPAC™ power factor corrected AC-DC power system, enabling system designers to forego fan and forced-air cooling in power systems designed for demanding military, industrial, telecommunications and other applications requiring fanless and/or noiseless operation in restrictive enclosures.

The new conduction-cooled MicroPAC power systems incorporate VI Chip® BCM® bus converters and are ideally suited for distributed power architectures, providing up to 1300 W of continuous power at up to 92% efficiency and 25 Win3 power density in a compact 4 x 1.72 x 7.45 inch package. Supporting the universal AC input range (85 - 264 Vac) and offering semi-regulated output voltages of 12, 14, 24, 28, 36 and 48 Vdc via four factory-configurable isolated outputs, the new conduction-cooled Westcor MicroPACs satisfy a wide range of customer power requirements. These systems also feature optional eco-mode operation settings via which the individual outputs are powered on only as needed, further enhancing overall power efficiency.

System designers seeking the flexibility to partition multiple voltage outputs rather than use two separate power supplies can configure MicroPACs with a combination of four high performance BCM high-voltage bus converters, which may be factory configured as single outputs, parallel outputs, or a series output with integrated current sharing. For applications requiring higher power levels, MicroPACs can be configured in arrays up to several kW with box-to-box current sharing.

The MicroPAC conduction-cooled power system has a base plate operational temperature range from -40°C to +65°C. The power supply lid (base plate) is designed to attach to heat-sinking surfaces, eliminating the need for fans or forced air cooling and enabling system designers to employ sealed enclosures to protect against moisture and particulate ingress.

"The new conduction-cooled Westcor MicroPAC configurable power systems give designers greater flexibility to ruggedize their systems for challenging conditions," said Jeff Lally, Westcor product manager. "This helps to enhance overall system integrity and lower noise output in demanding environments."

Pricing and Availability
Conduction-cooled 1300 W MicroPAC configurable power systems are priced as low as $460.00 for OEM quantities. For more information, including thermal design tips, visit the website. To order, email or call 1-800-735-6200.

About Westcor
Westcor specializes in high power AC-DC configurable power systems. By integrating Vicor's innovative, high performance power modules as core elements, Westcor provides complete power solutions configured to customers' specific needs across a wide variety of applications.

About Vicor Corporation
Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the wall plug to the point-of-load. Complementing an extensive portfolio of patented innovations in power conversion and power distribution with significant application development expertise, Vicor offers comprehensive product lines addressing a broad range of power conversion and management requirements across all power distribution architectures, including CPA, DPA, IBA, FPA™ and CBA. Vicor focuses on solutions for performance-critical applications in the following markets: enterprise and high performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics.

Vicor, Westcor, MicroPAC, VI Chip, BCM and FPA are trademarks of Vicor Corporation.

Contact Information

  • Contact:

    Colin Boroski
    Rainier Communications
    508-475-0025 x 142
    Email Contact