SOURCE: Virtium Technology

September 18, 2007 08:03 ET

Virtium Introduces New Family of Very Low Profile (VLP) DDR3 ECC SODIMM Memory Modules

VLP DDR3 Registered ECC SODIMM, VLP DDR3 ECC SODIMM, VLP DDR3 SO-RDIMM and VLP DDR3 SO-CDIMM

SAN FRANCISCO, CA--(Marketwire - September 18, 2007) - INTEL DEVELOPER FORUM, (Booth # 548) -- Virtium Technology Inc., manufacturer of memory modules for specialized computers in demanding environments, today announced its new family of small form-factor Very Low Profile VLP DDR3 Registered ECC SODIMM, VLP DDR3 ECC SODIMM, VLP DDR3 SO-RDIMM and VLP DDR3 SO-CDIMM ECC memory for embedded systems.

These new VLP DDR3 ECC SODIMMs are designed for space constrained next-generation AdvancedTCA, AdvancedMC, MicroTCA, PicoTCA, PC104, SBB canisters and PICMG SBCs.

Virtium VLP DDR3 SODIMM ECC memory modules are designed with significant enhancements to the JEDEC standard, including ECC SODIMM error correction, registered ECC SODIMM functionality for the VLP SORDIMM and reduced module height of 0.72 inches, enhanced from the JEDEC standard of 1.18 inches. All Virtium DDR3 ECC SODIMM memory modules are available with optional SODIMM heat-spreader, industrial temperature extended temperature range DRAM, or thermal sensors to improve thermal performance in demanding environments or for small compact chassis with limited internal space and minimal airflow.

The new DDR3 SODIMM memory modules operate at a lower Vdd voltage to deliver data bandwidths up to12800MB/second and use less power when compared to DDR2. DDR3 also provides larger prefetch for faster data access by the processor with better noise suppression and signal integrity using DDR3 differential data strobing, Dynamic I/O Signal Termination and On-die Dynamic Termination (ODT).

"The embedded computing industry demands highly reliable ruggedized memory solutions that push the envelope for small form factors while maintaining above average thermal characteristics," said Phan Hoang, director of research and development, Virtium Technology. "Our release of the new DDR3 ECC SODIMM, combined with new DDR3 ECC chipsets, is the next step in the evolution of DRAM memory technology to deliver cutting-edge memory solutions for embedded computing applications."

For specific module densities, mechanical specifications and datasheets or to request memory module samples, contact Virtium or visit http://www.virtium.com.

ABOUT VIRTIUM

Virtium Technology manufactures memory products for specialized computers in demanding environments such as embedded computing, military systems, storage, telecommunications and networking. Virtium is the only manufacturer going the extra mile to offer special services that save design engineers and procurement professionals time, money and deliver a worry-free experience.

Established in 1997, Virtium is a privately held, financially sound technology company with its own U.S.-based design and manufacturing facility. Headquartered in Southern California, the company maintains offices throughout the U.S. and Europe. For more information, call toll-free at 1-888-VIRTIUM (1-888-847-8486) or visit Virtium Technology online at http://www.virtium.com.

Contact Information

  • Contact:

    Bob Desmarais
    Virtium Technology
    Email Contact
    (949) 888-2444 x122 (Corporate)

    Jackie Zerbst/Sylvia Chansler
    MPowered Public Relations
    Email Contact
    (714) 998-3448