Zarlink Semiconductor Inc.
TSX : ZL
OTC Bulletin Board : ZARLF

Zarlink Semiconductor Inc.

February 15, 2011 09:30 ET

Zarlink and LSI Deliver Scalable Synchronization Solution for Wireless Backhaul

OTTAWA, CANADA--(Marketwire - Feb. 15, 2011) - Zarlink Semiconductor (TSX:ZL) today announced that its platform of Timing over Packet products together with the LSI® Axxia™ Communication Processor family is providing a complete, scalable solution supporting low-cost Ethernet backhaul deployments for wireless service providers.

"As smartphone users increasingly send and receive data intense traffic, including video, service providers must deploy Ethernet backhaul solutions to maintain reliable service and lower operating costs," said Jeremy Lewis, product line manager with Zarlink`s Timing and Synchronization group. "This scalable solution, with offerings from Zarlink and LSI, speeds time-to-market for manufacturers designing equipment for the fast-growing wireless backhaul market. Using this solution, wireless service providers can economically and efficiently upgrade their networks to support advanced communication services." 

The complete timing solution is compliant with the IEEE 1588-2008 standard and has been validated for interoperability. This offering provides timing and synchronization for 3G and LTE base stations, as well as emerging backhaul networks using boundary clock, enabling TDM infrastructure to be replaced with low-cost Ethernet based backhaul. Zarlink's ZL3034x devices and the LSI Axxia Communication Processor family provide combined "1588 & SyncE" Hybrid mode, which is in increasing demand from service providers due to its synchronization accuracy.

"This collaboration brings together award-winning traffic management capabilities from LSI and industry-leading packet timing products from Zarlink to deliver a complete and scalable solution for next-generation mobile networks," said Tareq Bustami, multicore communication processor product line director, LSI. "With this solution, service providers can deploy Ethernet backhaul to support data-intense communication services while reducing operating costs."

To learn more about Zarlink's Timing over Packet products, visit http://www.zarlink.com/zarlink/hs/timing_PacketNetworks.htm.

About Zarlink Semiconductor

Zarlink Semiconductor delivers world-leading, mixed-signal chip technologies for a broad range of communication and medical applications. The Company's core capabilities include network timing solutions that manage time-sensitive communication applications over wireless and wired networks, line circuits supporting high-quality voice services over cable and broadband connections, and ultra low-power radios enabling new wireless medical devices and therapies. Serving the world's largest original equipment manufacturers, Zarlink's highly integrated chip solutions help customers simplify design, lower costs and reach market quickly. For more information, visit www.zarlink.com.

Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Canadian Securities Regulatory Authorities, should visit the Company's web site at www.zarlink.com or contact Investor Relations.

Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: our dependence on the successful development and market introduction of new products; our ability to integrate any business, technologies, product lines or services that we have or will acquire; our dependence on revenue generation from our legacy products in order to fund development of our new products; current market conditions, including the lack of liquidity in the markets and economic slowdown, may increase our operating costs or reduce our revenue, thereby negatively impacting our operating results; our ability to operate profitably and generate positive cash flows in the future; the impact of the current economic crisis on our suppliers and customers and our ability to transfer parts to other suppliers; our dependence on our foundry suppliers and third-party subcontractors; order cancellations and deferrals by our customers; our substantial indebtedness could adversely affect our financial position; the cost and accounting implications of compliance with new accounting standards; and other factors referenced in our Annual Report on Form 20-F. Investors are encouraged to consider the risks detailed in this filing.

Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. LSI, LSI & Design logo, and Axxia, are trademarks or registered trademarks of LSI Corporation.

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