Zarlink Semiconductor Inc.
OTC Bulletin Board : ZARLF

Zarlink Semiconductor Inc.

September 26, 2011 09:30 ET

Zarlink to Discuss Miniaturization for Next-Generation Medical Devices at 2011 Medical Electronics Symposium

OTTAWA, CANADA--(Marketwire - Sept. 26, 2011) - Zarlink Semiconductor (TSX:ZL) today announced that it has been invited to discuss innovative packaging technologies developed to help shrink the size of electronic components used in implanted and on-body medical devices at the 2011 Medical Electronics Symposium (Sept. 27-28, Arizona State University, Tempe Campus).

The presentation, "Disappearing Die – The TIPS project", will be led by Martin McHugh, business development manager with Zarlink's Advanced Packaging group. The presentation will discuss Zarlink's involvement in the TIPS (Thin Interconnect Package Stack) Project and the successful creation of new processes to integrate complex electronics, such as processors, memories and radios, into ultra-thin stacked packages with a maximum layer thickness of 0.10 millimeters (mm).

"Miniaturization, wireless communication and ultra low-power consumption are key factors for device manufacturers designing smaller and lighter implanted and on-body products supporting advanced therapies," said Steve Swift, Vice President and General Manager of Zarlink's Medical Products Group. "Highly integrated packaging technologies developed through the TIPS Project distinguish Zarlink as we work with medical equipment manufacturers to simplify design of new products and therapies aimed at improving patient comfort and care."

Presentation Details

The Medical Electronics Symposium will be held in the Old Main building at Arizona State University in Tempe, Arizona. Zarlink's presentation will be on September 28th at 4 p.m.

About Zarlink Semiconductor

Zarlink Semiconductor delivers world-leading, mixed-signal chip technologies for a broad range of communication and medical applications. The Company's core capabilities include timing solutions that manage time-sensitive communication applications over wireless and wired networks, line circuits supporting high-quality voice services over cable and broadband connections, and ultra low-power radios enabling new wireless medical devices and therapies. Serving the world's largest original equipment manufacturers, Zarlink's highly integrated chip solutions help customers simplify design, lower costs and reach market quickly. For more information, visit

Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Canadian Securities Regulatory Authorities, should visit the Company's web site at or contact Investor Relations.

Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 and the applicable regulations of the Canadian Securities Administrators. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: our dependence on the successful development and market introduction of new products; our ability to integrate any business, technologies, product lines or services that we have or will acquire; our dependence on revenue generation from our legacy products in order to fund development of our new products; current market conditions, including the lack of liquidity in the markets and economic slowdown, may increase our operating costs or reduce our revenue, thereby negatively impacting our operating results; our ability to operate profitably and generate positive cash flows in the future; significant fluctuations in foreign exchange rates may adversely impact our results of operations; our dependence on our foundry suppliers and third-party subcontractors; order cancellations and deferrals by our customers; our substantial indebtedness could adversely affect our financial position; the cost and accounting implications of compliance with new accounting standards; and other factors referenced in our Annual Report on Form 20-F. Investors are encouraged to consider the risks detailed in this filing.

Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

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