Zarlink Semiconductor Inc.
OTC Bulletin Board : ZARLF

Zarlink Semiconductor Inc.

January 13, 2011 09:56 ET

Zarlink Member of IEEE 1588 Committee of Experts Developing Standards for Next-Generation Packet Network Timing

OTTAWA, CANADA--(Marketwire - Jan. 13, 2011) - Zarlink Semiconductor (TSX:ZL) today announced that it is a member of the newly formed IEEE 1588 Conformity Alliance Program's Committee of Experts.

Zarlink is one of the industry experts, which includes global service providers, standards developers and industry leaders in the field of timing and synchronization, developing test and certification programs to ensure IEEE 1588 solutions are standards-compliant and will meet performance and interoperability expectations in telecommunication networks.

"Industry standards are essential to the successful deployment of new technologies with telecommunication equipment manufacturers and global service providers," said Jeremy Lewis, Product Line Manager with Zarlink's Timing and Synchronization product line. "We look forward to driving the development of test and certification programs for next-generation packet network timing as part of this Committee of Experts."

Zarlink's platform of IEEE 1588 Timing over Packet (ToP) and Synchronous Ethernet products are currently deployed in wireless network equipment worldwide. Employing Zarlink's ToP and Synchronous Ethernet technology, wireless network operators can deliver revenue-generating voice, multimedia, data and mobile services over less expensive packet networks, while preserving service quality and performance for end-users. For more on Zarlink's IEEE 1588 solutions, visit 

The IEEE 1588 Conformity Alliance is managed by the IEEE Conformity Assessment Program (ICAP), a joint venture between IEEE and IEEE Industry Standards and Technology Organization (IEEE-ISTO). For further information about the IEEE 1588 Conformity Alliance, the Committee of Experts or membership information, visit

About Zarlink Semiconductor

Zarlink Semiconductor delivers world-leading, mixed-signal chip technologies for a broad range of communication and medical applications. The Company's core capabilities include network timing solutions that manage time-sensitive communication applications over wireless and wired networks, line circuits supporting high-quality voice services over cable and broadband connections, and ultra low-power radios enabling new wireless medical devices and therapies. Serving the world's largest original equipment manufacturers, Zarlink's highly integrated chip solutions help customers simplify design, lower costs and reach market quickly. For more information, visit

Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Canadian Securities Regulatory Authorities, should visit the Company's web site at or contact Investor Relations.

Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: our dependence on the successful development and market introduction of new products; our ability to integrate any business, technologies, product lines or services that we have or will acquire; our dependence on revenue generation from our legacy products in order to fund development of our new products; current market conditions, including the lack of liquidity in the markets and economic slowdown, may increase our operating costs or reduce our revenue, thereby negatively impacting our operating results; our ability to operate profitably and generate positive cash flows in the future; the impact of the current economic crisis on our suppliers and customers and our ability to transfer parts to other suppliers; our dependence on our foundry suppliers and third-party subcontractors; order cancellations and deferrals by our customers; our substantial indebtedness could adversely affect our financial position; the cost and accounting implications of compliance with new accounting standards; and other factors referenced in our Annual Report on Form 20-F. Investors are encouraged to consider the risks detailed in this filing.

Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

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